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Intel® Socket 1200 for 10th Gen Intel® Core™, Pentium® Gold and Celeron® Processors *
Supports Intel® 14 nm CPU
Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0**
4 x DIMM, Max. 128GB, DDR4 2933/2800/2666/2400/2133 MHz Non-ECC, Un-buffered Memory *
Dual Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
Intel® 10th Gen Processors
1 x PCIe 3.0 x16 (x16 mode)
Intel® H470 Chipset
1 x PCIe 3.0 x16 (x4 mode)
4 x PCIe 3.0 x1
Total supports 2 x M.2 slots and 6 x SATA 6Gb/s ports
Intel® H470 Chipset :
1 x M.2 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)
1 x M.2 Socket 3, with M Key, type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 x 2 mode)*1
6 x SATA 6Gb/s port(s)
Support Raid 0, 1, 5, 10
Intel® Rapid Storage Technology supports
Intel® Optane™ Memory Ready
Realtek® ALC887 8-Channel High Definition Audio CODEC *
- Supports : Jack-detection, Multi-recording, Front Panel Jack-retasking, up to 24-Bit/192kHz playback
Audio Feature :
- Audio Shielding
- Dedicated audio PCB layers
- Premium Japanese audio capacitors
|Back I/O Ports||
1 x PS/2 keyboard/mouse combo port(s)
1 x DisplayPort
1 x HDMI
1 x LAN (RJ45) port(s)
2 x USB 3.2 Gen 2 (1 x Type-A+1 x USB Type-C®)
2 x USB 3.2 Gen 1 Type-A
4 x USB 2.0 *2
3 x Audio jack(s)
ATX Form Factor
12 inch x 9.2 inch ( 30.5 cm x 23.4 cm )
VRM Heatsink and Thermal Pad
The VRM heatsink with underneath thermal pad improve heat transfer from the MOSFETs for better cooling performance.
An M.2 drive sits under a passive heatsink to ward off the throttling that can occur with sustained transfers. Removable captive screws reduce risk of drops or loss during heatsink removal.
Addressable Gen 2 RGB Header
The addressable Gen 2 RGB header is now capable of detecting the number of LEDs on second-gen addressable RGB devices, allowing the software to automatically tailor lighting effects to specific devices. The new header also offers backward-compatibility with existing Aura RGB gear.
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